Lau, John H.
Microvias : for low cost, high density interconnects / John H. Lau, S.W. Ricky Lee - New York, N.Y. : McGraw-Hill, c2001 - 565 p. : ill. - McGraw-Hill professional engineering .
Includes bibliographical references and index
0071363270
MICROELECTRONIC PACKAGING
INTEGRATED CIRCUITS--DESIGN AND CONSTRUCTION--COST CONTROL
SEMICONDUCTORS--JUNCTIONS
PRINTED CIRCUITS
TK7874 / L38M
Microvias : for low cost, high density interconnects / John H. Lau, S.W. Ricky Lee - New York, N.Y. : McGraw-Hill, c2001 - 565 p. : ill. - McGraw-Hill professional engineering .
Includes bibliographical references and index
0071363270
MICROELECTRONIC PACKAGING
INTEGRATED CIRCUITS--DESIGN AND CONSTRUCTION--COST CONTROL
SEMICONDUCTORS--JUNCTIONS
PRINTED CIRCUITS
TK7874 / L38M