Thermal management handbook for electronic assemblies

By: Sergent, Jerry.
Contributor(s): Krum, Al.
Material type: materialTypeLabelBookPublisher: New York, N.Y. : McGraw-Hill, 1998Description: 338.Call No.: TK7870.25 S473T Subject(s): ELECTRONIC APPARATUS AND APPLIANCES -- TEMPERATURE CONTROL | ELECTRONIC PACKAGING | MULTICHIP MODULES (MICROELECTRONICS) -- DESIGN AND CONSTRUCTIO
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