Integrated circuit, hybrid, and multichip module package design guidelines
By: Pecht, Michael.
Material type:
BookPublisher: New York, N.Y. : Wiley, 1994Description: 426.Call No.:
TK7870.15
P423I
Subject(s): MULTICHIP MODULES (MICROELECTRONICS) -- DESIGN AND CONSTRUCTION | HYBRID INTEGRATED CIRCUITS | ELECTRONIC PACKAGING -- DESIGN
| Current location | Call number | Status | Date due | Barcode |
|---|---|---|---|---|
| Main Campus Book Shelves | TK7870.15 P423I (Browse shelf) | Available | 144833 |
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| TK7870 S767E 1998 Electronics : | TK7870.15 C527S Surface mount technology for concurrent engineering and manufacturing / | TK7870.15 C527S Surface mount technology for concurrent engineering and manufacturing / | TK7870.15 P423I Integrated circuit, hybrid, and multichip module package design guidelines | TK7870.2 ช642ท ทฤษฏีตรวจซ่อมงานอิเล็กทรอนิกส์ | TK7870.2 D384C Consumer electronics troubleshooting & repair handbook | TK7870.2 D384T 1997 Troubleshooting and repairing consumer electronics without aschematic |
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