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Wire bonding in microelectronics : materials, processes, reliability and yield

By: Harman, George G.
Material type: materialTypeLabelBookPublisher: New York, N.Y. : McGraw-Hill, 1997Edition: 2nd ed.Description: 290.Call No.: TK7836 H375W 1997 Subject(s): WIRE BONDING (ELECTRONIC PACKAGING) -- PRODUCTION CONTROL | ELECTRONIC PACKAGING -- RELIABILITY | ELECTRONIC PACKAGING -- DEFECTS | SEMICONDUCTORS -- FAILURE
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Book Shelves 		TK7836 H375W 1997 (Browse shelf) Available 215786

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