Microvias : for low cost, high density interconnects / John H. Lau, S.W. Ricky Lee
By: Lau, John H.
Contributor(s): Lee, S.W. Ricky.
Material type: BookSeries: McGraw-Hill professional engineering.Publisher: New York, N.Y. : McGraw-Hill, c2001Description: 565 p. : ill.ISBN: 0071363270.Call No.: TK7874 L38M Subject(s): MICROELECTRONIC PACKAGING | INTEGRATED CIRCUITS -- DESIGN AND CONSTRUCTION -- COST CONTROL | SEMICONDUCTORS -- JUNCTIONS | PRINTED CIRCUITSBibliography, etc. Note: Includes bibliographical references and indexCurrent location | Call number | Status | Date due | Barcode |
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Main Campus Book Shelves | TK7874 L38M (Browse shelf) | Available | 200404160031 |
Browsing Main Campus Shelves , Shelving location: Book Shelves Close shelf browser
TK7874 J636A Analog integrated circuit design | TK7874 K677P Paths, flows, and VLSI-layout | TK7874 L343D Design of analog integrated circuits and systems | TK7874 L38M Microvias : | TK7874 L38M Microvias : | TK7874 L663G Gallium arsenide digital integrated circuit design | TK7874 M544I Intergrated electronics : analog and digital circuits and systems |
Includes bibliographical references and index
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