Sergent, Jerry <br/><br/>
Thermal management handbook for electronic assemblies 

 - New York, N.Y. :  McGraw-Hill,  1998 
 - 338 
<br/><br/><label>Subjects--Topical Terms: </label><br/>ELECTRONIC APPARATUS AND APPLIANCES--TEMPERATURE CONTROL<br/>ELECTRONIC PACKAGING<br/>MULTICHIP MODULES (MICROELECTRONICS)--DESIGN AND CONSTRUCTIO
<br/><br/><label>LC Class. No.: </label>TK7870.25  / S473T