TY  - BOOK
AU  - Pecht,Michael
TI  - Integrated circuit, hybrid, and multichip module package design guidelines
AV  - TK7870.15 P423I
PY  - 1994///
CY  - New York, N.Y.
PB  - Wiley
KW  - MULTICHIP MODULES (MICROELECTRONICS)
KW  - DESIGN AND CONSTRUCTION
KW  - HYBRID INTEGRATED CIRCUITS
KW  - ELECTRONIC PACKAGING
KW  - DESIGN
ER  -