TY  - BOOK
AU  - Harman,George G.
TI  - Wire bonding in microelectronics : materials, processes, reliability and yield
AV  - TK7836 H375W 1997
PY  - 1997///
CY  - New York, N.Y.
PB  - McGraw-Hill
KW  - WIRE BONDING (ELECTRONIC PACKAGING)
KW  - PRODUCTION CONTROL
KW  - ELECTRONIC PACKAGING
KW  - RELIABILITY
KW  - DEFECTS
KW  - SEMICONDUCTORS
KW  - FAILURE
ER  -