Multichip module technology handbook

By: Garrou, Philip E.
Contributor(s): Turlik, Iwona.
Material type: materialTypeLabelBookPublisher: New York, N.Y. : McGraw-Hill, 1998Description: 646.Call No.: TK7874 G377M Subject(s): MULTICHIP MODULES (MICROELECTRONICS) | MICROELECTRONIC PACKAGING | INTEGRATED CIRCUITS -- VERY LARGE SCALE INTEGRATION -- DESIGN AN
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