Pecht, Michael
Integrated circuit, hybrid, and multichip module package design guidelines - New York, N.Y. : Wiley, 1994 - 426
MULTICHIP MODULES (MICROELECTRONICS)--DESIGN AND CONSTRUCTION
HYBRID INTEGRATED CIRCUITS
ELECTRONIC PACKAGING--DESIGN
TK7870.15 / P423I
Integrated circuit, hybrid, and multichip module package design guidelines - New York, N.Y. : Wiley, 1994 - 426
MULTICHIP MODULES (MICROELECTRONICS)--DESIGN AND CONSTRUCTION
HYBRID INTEGRATED CIRCUITS
ELECTRONIC PACKAGING--DESIGN
TK7870.15 / P423I