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Integrated circuit, hybrid, and multichip module package design guidelines

By: Pecht, Michael.
Material type: materialTypeLabelBookPublisher: New York, N.Y. : Wiley, 1994Description: 426.Call No.: TK7870.15 P423I Subject(s): MULTICHIP MODULES (MICROELECTRONICS) -- DESIGN AND CONSTRUCTION | HYBRID INTEGRATED CIRCUITS | ELECTRONIC PACKAGING -- DESIGN
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Book Shelves 		TK7870.15 P423I (Browse shelf) Available 144833

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