Reliability of electronic packages and semiconductor devices
By: Giacomo, Giulio Di.
Material type:
BookPublisher: New York, N.Y. : McGraw-Hill, 1997Description: 410.Call No.:
TK7871.85
D534R
Subject(s): SEMICONDUCTORS -- RELIABILITY | MICROELECTRONIC PACKAGING -- RELIABILITY
| Current location | Call number | Status | Date due | Barcode |
|---|---|---|---|---|
| Main Campus Book Shelves | TK7871.85 D534R (Browse shelf) | Available | 194622 |
Browsing Main Campus Shelves , Shelving location: Book Shelves Close shelf browser
| TK7871.85 B374S 1993 Semiconductors and electronic devices | TK7871.85 C356S The science and engineering of microelectronic fabrication | TK7871.85 C356S The science and engineering of microelectronic fabrication | TK7871.85 D534R Reliability of electronic packages and semiconductor devices | TK7871.85 F534I Introduction to device modeling and circuit simulation | TK7871.85 F534I Introduction to device modeling and circuit simulation | TK7871.85 I226I Introduction to solid state devices |
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