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Microvias : for low cost, high density interconnects / John H. Lau, S.W. Ricky Lee

By: Lau, John H.
Contributor(s): Lee, S.W. Ricky.
Material type: materialTypeLabelBookSeries: McGraw-Hill professional engineering.Publisher: New York, N.Y. : McGraw-Hill, c2001Description: 565 p. : ill.ISBN: 0071363270.Call No.: TK7874 L38M Subject(s): MICROELECTRONIC PACKAGING | INTEGRATED CIRCUITS -- DESIGN AND CONSTRUCTION -- COST CONTROL | SEMICONDUCTORS -- JUNCTIONS | PRINTED CIRCUITSBibliography, etc. Note: Includes bibliographical references and index
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Main Campus
Book Shelves 		TK7874 L38M (Browse shelf) Available 200404160031

Includes bibliographical references and index

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