BANGKOK UNIVERSITY LIBRARY AND LEARNING SPACE catalog › Results of search for 'su,complete-subfield:{MICROELECTRONIC PACKAGING}'

Your search returned 4 results.

	1.		Mems & microsystems : design and manufacture / Tai-Ran Hsu by Hsu, Tai-Ran. Edition: International ed.Material type: Book; Literary form: Not fiction ; Audience: Specialized; Publisher: Boston, Mass. : McGraw-Hill, 2002Other title: Mems and microsystems : design and manufacture.Accession number(s): 200512030037.Availability: Items available for loan: Main Campus [Call number: TK7874 H78M 2002] (1). Place hold Add to cart (remove)
	2.		Microvias : for low cost, high density interconnects / John H. Lau, S.W. Ricky Lee by Lau, John H \| Lee, S.W. Ricky. Material type: Book; Literary form: Not fiction ; Audience: Specialized; Publisher: New York, N.Y. : McGraw-Hill, c2001Accession number(s): 200404160030, 200404160031.Availability: Items available for loan: Main Campus [Call number: TK7874 L38M] (1). Place hold Add to cart (remove)
	3.		Multichip module technology handbook by Garrou, Philip E \| Turlik, Iwona. Material type: Book; Format: print ; Literary form: Not fiction Publisher: New York, N.Y. : McGraw-Hill, 1998Accession number(s): 215791.Availability: Items available for loan: Main Campus [Call number: TK7874 G377M] (1). Place hold Add to cart (remove)
	4.		Reliability of electronic packages and semiconductor devices by Giacomo, Giulio Di. Material type: Book; Format: print ; Literary form: Not fiction Publisher: New York, N.Y. : McGraw-Hill, 1997Accession number(s): 194622.Availability: Items available for loan: Main Campus [Call number: TK7871.85 D534R] (1). Place hold Add to cart (remove)

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