BANGKOK UNIVERSITY LIBRARY AND LEARNING SPACE catalog › Results of search for 'su,complete-subfield:{MULTICHIP MODULES MICROELECTRONICS}'

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	1.		Integrated circuit, hybrid, and multichip module package design guidelines by Pecht, Michael. Material type: Book; Format: print ; Literary form: Not fiction Publisher: New York, N.Y. : Wiley, 1994Accession number(s): 144833.Availability: Items available for loan: Main Campus [Call number: TK7870.15 P423I] (1). Place hold Add to cart (remove)
	2.		Multichip module technology handbook by Garrou, Philip E \| Turlik, Iwona. Material type: Book; Format: print ; Literary form: Not fiction Publisher: New York, N.Y. : McGraw-Hill, 1998Accession number(s): 215791.Availability: Items available for loan: Main Campus [Call number: TK7874 G377M] (1). Place hold Add to cart (remove)
	3.		Thermal management handbook for electronic assemblies by Sergent, Jerry \| Krum, Al. Material type: Book; Format: print ; Literary form: Not fiction Publisher: New York, N.Y. : McGraw-Hill, 1998Accession number(s): 215790.Availability: Items available for loan: Main Campus [Call number: TK7870.25 S473T] (1). Place hold Add to cart (remove)

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