BANGKOK UNIVERSITY LIBRARY AND LEARNING SPACE catalog › Results of search for 'su,complete-subfield:{Electronic packaging}'

Your search returned 5 results.

	1.		Integrated circuit, hybrid, and multichip module package design guidelines by Pecht, Michael. Material type: Book; Format: print ; Literary form: Not fiction Publisher: New York, N.Y. : Wiley, 1994Accession number(s): 144833.Availability: Items available for loan: Main Campus [Call number: TK7870.15 P423I] (1). Place hold Add to cart (remove)
	2.		Materials for electronic packaging [electronic resource] / edited by Deborah D.L. Chung. by Chung, Deborah D. L [ed.]. Material type: Book; Format: print ; Literary form: Not fiction Publisher: Boston, MA : Butterworth-Heinemann, ©1995Online access: Electronic Resources Availability: No items available Add to cart (remove)
	3.		Surface mount technology for concurrent engineering and manufacturing / Frank Classon by Classon, Frank. Material type: Book; Literary form: Not fiction ; Audience: Specialized; Publisher: New York, N.Y. : McGraw-Hill, 1993Accession number(s): 129941, 129942.Availability: Items available for loan: Main Campus [Call number: TK7870.15 C527S] (1). Place hold Add to cart (remove)
	4.		Thermal management handbook for electronic assemblies by Sergent, Jerry \| Krum, Al. Material type: Book; Format: print ; Literary form: Not fiction Publisher: New York, N.Y. : McGraw-Hill, 1998Accession number(s): 215790.Availability: Items available for loan: Main Campus [Call number: TK7870.25 S473T] (1). Place hold Add to cart (remove)
	5.		Wire bonding in microelectronics : materials, processes, reliability and yield by Harman, George G. Edition: 2nd ed.Material type: Book; Format: print ; Literary form: Not fiction Publisher: New York, N.Y. : McGraw-Hill, 1997Accession number(s): 215786.Availability: Items available for loan: Main Campus [Call number: TK7836 H375W 1997] (1). Place hold Add to cart (remove)

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